Inventor · name-matched record
JU SHI NING
7 granted patents·3 pending applications·0 citations·filing 2021–2025
70Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
10 records- 0184US12563816B2Method for forming sidewall spacers disposed above mask layer and semiconductor devices fabricated thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 24, 2026·0 cites·20 claims
- 0282US2026026044A1Gate isolation and connection of multigate devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0375US12557376B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 0474US12593475B2Field effect transistor with isolation structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 31, 2026·0 cites·20 claims
- 0573US12598787B2Field effect transistor with dual layer isolation structure and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 0668US12593494B2Multi-gate device and related methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 31, 2026·0 cites·20 claims
- 0760US2026068204A1Methods for forming semiconductor device having nanosheet transistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0856US12520565B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims
- 0954US12575464B2Method of forming wafer-to-wafer bonding structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 10, 2026·0 cites·20 claims
- 1053US2026101577A1Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →