Inventor · name-matched record
JUN KIMIN
4 granted patents·1 pending application·0 citations·filing 2021–2025
52Inventor score
Files withINTEL CORP5
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0196US2026018565A1Monolithic chip stacking using a die with double-sided interconnect layersINTEL CORP·Filed 2025·Application pending·0 cites
- 0259US12538841B2Quasi-monolithic die architecturesINTEL CORP·Filed 2022·Granted Jan 27, 2026·0 cites·20 claims
- 0358US12581938B2Package architecture for quasi-monolithic chip with backside powerINTEL CORP·Filed 2022·Granted Mar 17, 2026·0 cites·15 claims
- 0458US12581968B2Package architecture of large dies using quasi-monolithic chip layersINTEL CORP·Filed 2022·Granted Mar 17, 2026·0 cites·20 claims
- 0551US12526985B2Back-side reveal for power delivery to backend memory with frontend transistors and backend memroy cellsINTEL CORP·Filed 2021·Granted Jan 13, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →