Inventor · name-matched record
KANG KUIWON
2 granted patents·2 pending applications·0 citations·filing 2023–2024
22Inventor score
Files withQUALCOMM INC4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0162US12581966B2Electronic component placed on core of substrateQUALCOMM INC·Filed 2023·Granted Mar 17, 2026·0 cites·27 claims
- 0262US2026090414A1ADHERED SAP SUBSTRATE FOR CuBOL ASSEMBLY PACKAGEQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0355US2026040973A1Package substrate with core having metallization layers to facilitate signal routing within the core, and related fabrication methods and integrated circuit (ic) packagesQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0451US12593408B2Package substrate having embedded electronic component in a core of the package substrateQUALCOMM INC·Filed 2023·Granted Mar 31, 2026·0 cites·28 claims
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Identity basis: exact name match across USPTO filings. How scoring works →