Inventor · name-matched record
KARHADE OMKAR
6 granted patents·0 citations·filing 2020–2021
63Inventor score
Files withINTEL CORP6
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0164US12525545B2HBI die fiducial architecture with cantilever fiducials for smaller die size and better yieldsINTEL CORP·Filed 2021·Granted Jan 13, 2026·0 cites·19 claims
- 0262US12599007B2Composite IC die package including an electro-thermo-mechanical die (ETMD) with through substrate viasINTEL CORP·Filed 2021·Granted Apr 7, 2026·0 cites·16 claims
- 0357US12599050B2Multi-level die coupled with a substrateINTEL CORP·Filed 2021·Granted Apr 7, 2026·0 cites·21 claims
- 0455US12564090B2Edge-aligned template structure for integrated packages including an integrated circuit device within an opening of the template structureINTEL CORP·Filed 2021·Granted Feb 24, 2026·0 cites·20 claims
- 0550US12541055B2Electronic device including a lens assemblyINTEL CORP·Filed 2021·Granted Feb 3, 2026·0 cites·22 claims
- 0649US12517314B2High bandwidth optical interconnection architecturesINTEL CORP·Filed 2020·Granted Jan 6, 2026·0 cites·17 claims
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Identity basis: exact name match across USPTO filings. How scoring works →