Inventor · name-matched record
KATKAR RAJESH
4 granted patents·21 pending applications·0 citations·filing 2021–2025
56Inventor score
Files withADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC19ADEIA SEMICONDUCTOR TECH LLC3ADEIA SEMICONDUCTOR BONDING TECH INC2ADEIA SEMICONDUCTOR INC1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
25 records- 0197US2026041011A1Direct-bonded optoelectronic devicesADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
- 0296US2026052693A13d nand - high aspect ratio strings and channelsADEIA SEMICONDUCTOR INC·Filed 2025·Application pending·0 cites
- 0395US2026072279A1Bonded optical devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0495US2026082960A1Bonded structures with integrated passive componentADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0594US2026041012A1Direct-bonded optoelectronic interconnect for high-density integrated photonicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0694US2026060053A1Metal pads over tsvADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0783US2026082717A1Image sensor deviceADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
- 0882US2026041003A1Symbiotic Network On LayersADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
- 0980US12564084B2Bonded structures without intervening adhesiveADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Feb 24, 2026·0 cites·38 claims
- 1075US2026018490A1Embedded cooling systems for advanced device packaging and methods of manufacturing the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 1171US12581994B2Direct-bonded optoelectronic interconnect for high-density integrated photonicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Mar 17, 2026·0 cites·25 claims
- 1270US12543568B2Thermoelectric cooling for die packagesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Feb 3, 2026·0 cites·13 claims
- 1369US2026040750A1Efficient assembly for led displaysADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1469US2026053023A1Folded high-bandwidth memory systemsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1568US2026020415A1Normal emitting stacked monochromatic wafers for color pixel displays and methods related theretoADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1668US2026020407A1Stacked monochromatic wafers with edge emitted leds for color pixel displays and methods related theretoADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1765US2026026310A1Methods and systems for hybrid bonding large substratesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1864US2026068632A1Backside power delivery attachmentADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1963US2026026013A1Hybrid bonded memory and logic devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 2063US2026059905A1Optical emitter structures with integrated distributed bragg reflectorsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 2163US2026052950A1Semiconductor elements with hybrid bonding layersADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 2261US2026033312A1Structures and methods for thermal dissipation in diesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 2361US2026033359A1Connecting element for semiconductor devicesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 2458US12598962B2System and method for bonding transparent conductor substratesADEIA SEMICONDUCTOR BONDING TECH INC·Filed 2023·Granted Apr 7, 2026·0 cites·17 claims
- 2557US2026101809A1Encapsulated hybrid bonded structuresADEIA SEMICONDUCTOR BONDING TECH INC·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →