Inventor · name-matched record
KIM JINGU
2 granted patents·0 citations·filing 2023–2023
22Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0157US12525526B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 13, 2026·0 cites·20 claims
- 0256US12575418B2Semiconductor packages having organic material layer between through-via structure and encapsulant that surrounds a portion of semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 10, 2026·0 cites·17 claims
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Identity basis: exact name match across USPTO filings. How scoring works →