Inventor · name-matched record
KIM KWANG-SOO
5 granted patents·18 pending applications·0 citations·filing 2020–2025
59Inventor score
Files withMONOLITHIC POWER SYSTEMS INC11TEXAS INSTRUMENTS INC8SAMSUNG ELECTRONICS CO LTD3MCLEAN HOSPITAL CORP1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
23 records- 0185US2026033395A1STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPMTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0285US2026033331A1Thermally enhanced embedded die packageTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0384US2026083017A1Semiconductor device package with vertically stacked passive componentTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0483US2026082990A1Half bridge ceramic hermetic package structureTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0579US2026045400A1Packaged module with composite magnetic molding material having improved performanceMONOLITHIC POWER SYSTEMS INC·Filed 2025·Application pending·0 cites
- 0679US2026045393A1Composite magnetic material with surface coated magnetic particles and associated device and methodMONOLITHIC POWER SYSTEMS INC·Filed 2025·Application pending·0 cites
- 0779US2026045394A1Composite magnetic material providing high magnetic permeabilityMONOLITHIC POWER SYSTEMS INC·Filed 2025·Application pending·0 cites
- 0879US2026045392A1Low modulus composite magnetic material and associated device and methodMONOLITHIC POWER SYSTEMS INC·Filed 2025·Application pending·0 cites
- 0979US2026045391A1Composite magnetic material with magnetic filler dispersed in composite non-magnetic material and associated device and methodMONOLITHIC POWER SYSTEMS INC·Filed 2025·Application pending·0 cites
- 1079US2026047443A1Packaged module with low modulus composite magnetic molding materialMONOLITHIC POWER SYSTEMS INC·Filed 2025·Application pending·0 cites
- 1179US2026045395A1Packaged module with novel composite magnetic molding materialMONOLITHIC POWER SYSTEMS INC·Filed 2025·Application pending·0 cites
- 1279US2026042905A1Composite magnetic material with improved magnetic filler and associated device and methodMONOLITHIC POWER SYSTEMS INC·Filed 2025·Application pending·0 cites
- 1375US2026047111A1Packaged module with integrated inductive componentMONOLITHIC POWER SYSTEMS INC·Filed 2025·Application pending·0 cites
- 1475US2026047442A1Packaged module with integrated inductive componentMONOLITHIC POWER SYSTEMS INC·Filed 2025·Application pending·0 cites
- 1572US12532786B2Semiconductor device package with vertically stacked passive componentTEXAS INSTRUMENTS INC·Filed 2023·Granted Jan 20, 2026·0 cites·17 claims
- 1668US12557658B2Molded module package with an EMI shielding barrierTEXAS INSTRUMENTS INC·Filed 2023·Granted Feb 17, 2026·0 cites·19 claims
- 1766US2026047110A1Packaged module with integrated inductive componentMONOLITHIC POWER SYSTEMS INC·Filed 2025·Application pending·0 cites
- 1864US2026089951A1Semiconductor memory device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1964US2026045281A1Semiconductor memory device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2062US2026040964A1Semiconductor package including a molded interconnectTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 2158US12584105B2Autologous cell replacement therapy for Parkinson's diseaseMCLEAN HOSPITAL CORP·Filed 2020·Granted Mar 24, 2026·0 cites·20 claims
- 2254US12581980B2IC package with field effect transistorTEXAS INSTRUMENTS INC·Filed 2022·Granted Mar 17, 2026·0 cites·16 claims
- 2354US12564018B2Operating method of electronic device configured to support manufacturing semiconductor device, and operating method of semiconductor manufacturing system including electronic devices configured to support manufacturing semiconductor diesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 24, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →