Inventor · name-matched record
KIM WOOCHAN
4 granted patents·5 pending applications·0 citations·filing 2020–2025
52Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
9 records- 0185US2026033395A1STACKED CLIP DESIGN FOR GaN HALF BRIDGE IPMTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0285US2026033331A1Thermally enhanced embedded die packageTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0375US2026005150A1Power Module with Multi-Layer Substrate and Second Insulation Layer to Increase Power DensityTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0468US12557658B2Molded module package with an EMI shielding barrierTEXAS INSTRUMENTS INC·Filed 2023·Granted Feb 17, 2026·0 cites·19 claims
- 0562US2026040964A1Semiconductor package including a molded interconnectTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0659US2026041017A1Microelectronics device package with isolation and ceramic interposer forming thermal padTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0750US12537614B2Method for transmitting and receiving data in wireless communication system supporting full duplex communication, and apparatus thereforLG ELECTRONICS INC·Filed 2020·Granted Jan 27, 2026·0 cites·10 claims
- 0849US12550203B2Method for transmitting and receiving data in wireless communication system supporting full duplex communication, and apparatus thereforLG ELECTRONICS INC·Filed 2020·Granted Feb 10, 2026·0 cites·13 claims
- 0949US12538118B2Method for transmitting/receiving data in wireless communication system, and apparatus thereforLG ELECTRONICS INC·Filed 2020·Granted Jan 27, 2026·0 cites·10 claims
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Identity basis: exact name match across USPTO filings. How scoring works →