Inventor · name-matched record
KIM YOUNGBAE
3 granted patents·10 pending applications·0 citations·filing 2022–2025
38Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
13 records- 0167US12598961B2Semiconductor package including test pattern and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 7, 2026·0 cites·17 claims
- 0260US2026090473A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0359US12543580B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 3, 2026·0 cites·19 claims
- 0453US2026101819A1Semiconductor package including connection terminalsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0551US2026090387A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0651US2026096224A1High voltage power device with electrostatic discharge self-protection structureSK KEYFOUNDRY INC·Filed 2025·Application pending·0 cites
- 0751US2026059864A1High voltage semiconductor device with electrostatic discharge self-protection structureSK KEYFOUNDRY INC·Filed 2025·Application pending·0 cites
- 0850US2026075958A1High voltage semiconductor device comprising level shifter with electrostatic discharge self-protection structureSK KEYFOUNDRY INC·Filed 2025·Application pending·0 cites
- 0950US2026053066A1Semiconductor package including a core die and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1048US2026018482A1Semiconductor package including a heat dissipation metal member and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1148US2026068715A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1243US2026060081A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1336US12527074B2Semiconductor device with bootstrap diodeSK KEYFOUNDRY INC·Filed 2022·Granted Jan 13, 2026·0 cites·14 claims
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Identity basis: exact name match across USPTO filings. How scoring works →