Inventor · name-matched record
KOBUNE MIKA
1 granted patent·2 pending applications·0 citations·filing 2022–2025
14Inventor score
Technology areasH10W
Files withRESONAC CORP3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0177US2026060078A1Heat conduction sheet, heat dissipating device, and method of manufacturing heat conduction sheetRESONAC CORP·Filed 2025·Application pending·0 cites
- 0273US2026008645A1Thermal conduction sheet holder and method of manufacturing heat dissipating deviceRESONAC CORP·Filed 2025·Application pending·0 cites
- 0368US12550730B2Method of manufacturing semiconductor device, thermally conductive sheet, and method of manufacturing thermally conductive sheetRESONAC CORP·Filed 2022·Granted Feb 10, 2026·0 cites·5 claims
Join the waitlist — get patent alerts
Get an alert when KOBUNE MIKA files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →