Inventor · name-matched record
KUH BONGJIN
2 granted patents·1 pending application·0 citations·filing 2022–2025
23Inventor score
Technology areasH10D
Files withSAMSUNG ELECTRONICS CO LTD3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0177US2026040631A1Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0262US12573522B2Thin-film structure and semiconductor device comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 10, 2026·0 cites·20 claims
- 0356US12563811B2Integrated circuit deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 24, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →