Inventor · name-matched record

KUO CHUN-TING

2 granted patents·0 citations·filing 2023–2023

25Inventor score

Technology areasG01N H01L

Files withCHIPBOND TECHNOLOGY CORP1 UNIV WASHINGTON1

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

Top patents by PatentIndex Score

2 records

0178US12553891B2Systems and methods for cyclic fluorescence imagingUNIV WASHINGTON·Filed 2023·Granted Feb 17, 2026·0 cites·16 claims
0257US12543581B2Flip-chip bonding structure and substrate thereofCHIPBOND TECHNOLOGY CORP·Filed 2023·Granted Feb 3, 2026·0 cites·10 claims

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Identity basis: exact name match across USPTO filings. How scoring works →