Inventor · name-matched record
KUO HUNG-YI
1 granted patent·2 pending applications·0 citations·filing 2022–2024
13Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0173US12543569B2Package with improved heat dissipation efficiency and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 3, 2026·0 cites·20 claims
- 0264US2026096477A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0356US2026011646A1Structure and formation method of integrated chips package with thermal conductive elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →