Inventor · name-matched record
LAI PO-CHEN
3 granted patents·3 pending applications·0 citations·filing 2022–2025
48Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0191US2026076205A1Methods of forming a semiconductor package including stress buffersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0291US2026090423A1Semiconductor Package and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0384US12550770B2Embedded stress absorber in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0478US12538852B2Package structure containing chip structure with inclined sidewallsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 27, 2026·0 cites·20 claims
- 0572US12557645B2Semiconductor packages with thermal lid and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 17, 2026·0 cites·20 claims
- 0658US2026101782A1Semiconductor packages and methods of formationTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →