Inventor · name-matched record
LAI YU-CHIA
2 granted patents·3 pending applications·0 citations·filing 2022–2025
27Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0191US2026101715A1Package structureTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0283US12538827B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 27, 2026·0 cites·20 claims
- 0383US2026090476A1Semiconductor package and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0462US2026026315A1Sacrificial pad design for semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0554US12525501B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 13, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →