Inventor · name-matched record
LAN JE-HSIUNG
2 granted patents·3 pending applications·0 citations·filing 2022–2024
23Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0169US2026101524A1Inductive device with integrated inductorsQUALCOMM INCORPORATED·Filed 2024·Application pending·0 cites
- 0264US12543328B2Inductive device structure and process methodQUALCOMM INC·Filed 2022·Granted Feb 3, 2026·0 cites·11 claims
- 0363US2026052973A1Configurable bonding pad routingQUALCOMM INC·Filed 2024·Application pending·0 cites
- 0460US12581956B2Through molding contact enabled EMI shieldingQUALCOMM INC·Filed 2022·Granted Mar 17, 2026·0 cites·27 claims
- 0560US2026005154A1Electromagnetic interference shield having mesh grid ground fence metallization patternQUALCOMM INC·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →