Inventor · name-matched record
LANZILLO NICHOLAS ANTHONY
18 granted patents·10 pending applications·1 citations·filing 2021–2024
86Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
28 records- 0192US12538553B2Contact structure for power delivery on semiconductor deviceIBM·Filed 2022·Granted Jan 27, 2026·1 cites·20 claims
- 0272US12598970B2Top via on subtractively etched conductive lineINT BUSINESS MACHINES CORPORATION·Filed 2022·Granted Apr 7, 2026·0 cites·13 claims
- 0371US12588487B2Tight pitch directional selective via growthIBM·Filed 2023·Granted Mar 24, 2026·0 cites·18 claims
- 0471US12557298B2Resistive random access memory on a buried bitlineIBM·Filed 2022·Granted Feb 17, 2026·0 cites·20 claims
- 0569US2026056475A1Reticle stitching for semiconductorsIBM·Filed 2024·Application pending·0 cites
- 0666US12550713B2Hybrid buried power rail structure with dual front side and backside processingIBM·Filed 2022·Granted Feb 10, 2026·0 cites·18 claims
- 0765US12588277B2Forming wrap around contact with self-aligned backside contactIBM·Filed 2023·Granted Mar 24, 2026·0 cites·13 claims
- 0864US12557328B2Vertical-transport field-effect transistor with backside source/drain connectionsIBM·Filed 2022·Granted Feb 17, 2026·0 cites·19 claims
- 0964US12550704B2Subtractive skip viaIBM·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 1064US12550719B2VTFET circuit with optimized outputIBM·Filed 2022·Granted Feb 10, 2026·0 cites·12 claims
- 1164US2026076167A1Interconnect structure for semiconductor device with airgapIBM·Filed 2024·Application pending·0 cites
- 1263US2026059803A1Forksheet device with minimum gate metal and gate extensionIBM·Filed 2024·Application pending·0 cites
- 1362US2026068307A1Stacked transistors with work function materialIBM·Filed 2024·Application pending·0 cites
- 1462US2026033315A1Power Gating in Integrated CircuitIBM·Filed 2024·Application pending·0 cites
- 1561US12525529B2Forming line end viasIBM·Filed 2022·Granted Jan 13, 2026·0 cites·12 claims
- 1661US2026020340A1Stacked fets with interdevice power deliveryIBM·Filed 2024·Application pending·0 cites
- 1761US2026040636A1Backside local well tapIBM·Filed 2024·Application pending·0 cites
- 1861US2026052732A1Power gating by backside wiringIBM·Filed 2024·Application pending·0 cites
- 1961US2026047195A1Nanosheet transistors with level-to-level gate strappingIBM·Filed 2024·Application pending·0 cites
- 2060US12588280B2Backsides subtractive M1 patterning with backside contact repair for tight N2P spaceIBM·Filed 2023·Granted Mar 24, 2026·0 cites·16 claims
- 2160US12575399B2Interconnect structure including vertically stacked power and ground linesIBM·Filed 2022·Granted Mar 10, 2026·0 cites·18 claims
- 2260US12575402B2Non-planar metal-insulator-metal structureIBM·Filed 2022·Granted Mar 10, 2026·0 cites·20 claims
- 2360US12557637B2Stacked transistors with metal viasIBM·Filed 2023·Granted Feb 17, 2026·0 cites·20 claims
- 2458US12568645B2Vertical field effect transistor with self-aligned backside trench epitaxyIBM·Filed 2022·Granted Mar 3, 2026·0 cites·16 claims
- 2557US2026059855A1Terminal region contact structures for field-effect transistorsIBM·Filed 2024·Application pending·0 cites
- 2656US12575400B2Power planes and pass-through viasIBM·Filed 2022·Granted Mar 10, 2026·0 cites·12 claims
- 2755US12598983B2Interconnects formed using integrated damascene and subtractive etch processingINT BUSINESS MACHINES CORPORATION·Filed 2021·Granted Apr 7, 2026·0 cites·20 claims
- 2855US12568806B2Conformal dielectric cap for subtractive viasIBM·Filed 2021·Granted Mar 3, 2026·0 cites·8 claims
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Identity basis: exact name match across USPTO filings. How scoring works →