Inventor · name-matched record
LEE CHANGBO
2 granted patents·2 pending applications·0 citations·filing 2022–2025
23Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0155US12575398B2Interconnection structure and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 10, 2026·0 cites·20 claims
- 0254US12550759B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 0353US2026082986A1Semiconductor package and manufacturing method of the same, and manufacturing method of semiconductor device for reconstitution processSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0450US2026068733A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →