Inventor · name-matched record
LEE CHENG-CHIN
3 granted patents·3 pending applications·0 citations·filing 2021–2025
48Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0183US12581928B2Interconnect structure with protective etch-stopTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 17, 2026·0 cites·20 claims
- 0283US12550694B2Selective deposition for integrated circuit interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0382US2026033305A1Low-resistance interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0467US12538773B2Semiconductor structure having self-aligned conductive structure and method for forming the semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 27, 2026·0 cites·20 claims
- 0559US2026026338A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0657US2026096420A1Interconnect structure having metal features with different volume and materials, and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →