Inventor · name-matched record
LEE CHI-MING
0 granted patents·2 pending applications·0 citations·filing 2024–2025
Files withMEDIATEK INC2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0161US2026023908A1Machine Learning-based Wafer Testing Yield Boosting Method and System Capable of Predicting Die-level Wafer Acceptance Test ParametersMEDIATEK INC·Filed 2025·Application pending·0 cites
- 0258US2026100769A1Method for determining signal quality and associated receiverMEDIATEK INC·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when LEE CHI-MING files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →