Inventor · name-matched record
LEE CHIEN-CHEN
2 granted patents·3 pending applications·0 citations·filing 2023–2025
22Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0187US2026033027A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2025·Application pending·0 cites
- 0286US2026068340A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2025·Application pending·0 cites
- 0386US2026068339A1Sensor package structure and chip-scale sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2025·Application pending·0 cites
- 0454US12598821B2Chip package structure and method for producing the sameTONG HSING ELECTRONIC IND LTD·Filed 2023·Granted Apr 7, 2026·0 cites·13 claims
- 0554US12538598B2Chip package structure and method for fabricating the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Jan 27, 2026·0 cites·15 claims
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Identity basis: exact name match across USPTO filings. How scoring works →