Inventor · name-matched record
LEE CHIEN-HSUN
2 granted patents·7 pending applications·0 citations·filing 2023–2025
30Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6TAIWAN SEMICONDUCTOR MFG COMPANY LTD2PARABELLUM STRATEGIC OPPORTUNITIES FUND LLC1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
9 records- 0198US2026083023A1Package structures and methods of making the samePARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2025·Application pending·0 cites
- 0297US2026060151A1Packages with stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0395US2026101806A1Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0485US12519024B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 6, 2026·0 cites·20 claims
- 0568US12593704B2Three-dimensional semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 31, 2026·0 cites·20 claims
- 0662US2026076258A1Package structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0760US2026011554A1Redistribution interposer for package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0848US2026101752A1Heat dissipation through redistribution structureTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0946US2026096426A1Heat dissipation structure for integrated circuit packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →