Inventor · name-matched record
LEE CHUNGKEUN
3 granted patents·6 pending applications·0 citations·filing 2022–2025
40Inventor score
Files withSAMSUNG ELECTRONICS CO LTD9
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
9 records- 0187US2026012988A1Method and apparatus for identifying user in radio access network communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0285US2026095879A1Apparatus and method for controlling e2 node in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0383US2026019881A1Apparatus and method for e2 interface configuration including cell information in wireless access networkSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0466US2026052394A1Electronic device and method for spectrum aggregation in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0564US2026019348A1Apparatus and method for guaranteeing service level agreement item of terminal in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0663US12557009B2Apparatus and method for E2 node control and cell control in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 17, 2026·0 cites·14 claims
- 0762US12520195B2Apparatus and method for transmitting E2 message in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 6, 2026·0 cites·16 claims
- 0859US12598542B2Apparatus and method for managing user equipment in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 0959US2026012403A1Apparatus and method for guaranteeing service level agreement item of network slice in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →