Inventor · name-matched record
LEE CHUNGSUN
2 granted patents·1 pending application·0 citations·filing 2023–2025
25Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0180US2026101825A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0273US12593702B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Mar 31, 2026·0 cites·20 claims
- 0359US12568837B2Semiconductor chip, semiconductor package including the same, and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 3, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →