Inventor · name-matched record
LEE GONGJE
1 granted patent·2 pending applications·0 citations·filing 2023–2025
5Inventor score
Files withSAMSUNG ELECTRONICS CO LTD3
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0176US2026005123A1Semiconductor package including postSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0257US12525526B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 13, 2026·0 cites·20 claims
- 0352US2026040975A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →