Inventor · name-matched record
LEE GUNHYUCK
1 granted patent·1 pending application·0 citations·filing 2022–2025
3Inventor score
Technology areasH01L
Files withSTATS CHIPPAC PTE LTD2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0174US2026033356A1Method for forming an interconnect device and a method for forming a semiconductor package assemblySTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 0245US12538840B2Semiconductor device and method of forming module-in-package structure using redistribution layerSTATS CHIPPAC PTE LTD·Filed 2022·Granted Jan 27, 2026·0 cites·18 claims
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Identity basis: exact name match across USPTO filings. How scoring works →