Inventor · name-matched record
LEE HEESOO
7 granted patents·12 pending applications·0 citations·filing 2022–2025
67Inventor score
Files withJCET STATS CHIPPAC KOREA LTD8ELECTRONICS & TELECOMMUNICATIONS RES INST7STATS CHIPPAC PTE LTD4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
19 records- 0186US2026040162A1Method and apparatus for improving handover performance in communication systemELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2025·Application pending·0 cites
- 0276US2026018573A1Semiconductor Device and Method of Forming Compartment Shielding for a Semiconductor PackageJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 0366US2026046859A1Method and apparatus for intelligent beam management in communication networkELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2025·Application pending·0 cites
- 0464US12549968B2Method and apparatus for configuring artificial neural network for wireless communication in mobile communication systemELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Granted Feb 10, 2026·0 cites·17 claims
- 0564US2026083029A1Semiconductor package and method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 0664US2026076244A1Method and an apparatus for forming an electronic deviceJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 0764US2026052601A1Method and apparatus for power consumption saving of terminalELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2025·Application pending·0 cites
- 0863US12543173B2Method and apparatus for predicting traffic and transmitting a buffer prediction status reportELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Granted Feb 3, 2026·0 cites·16 claims
- 0963US2026082974A1Semiconductor Device and Method of Making Using Epoxy-Solder PasteJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 1061US2026005191A1Semiconductor Device and Method of Forming Interconnect Structure in HBM Module Using VFMJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 1160US2026005190A1Semiconductor Device and Method of Forming Interconnect Structure Using VFM and TCBJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 1259US12549995B2Apparatus and method for transmission and reception of channel state information based on artificial intelligenceELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Granted Feb 10, 2026·0 cites·18 claims
- 1359US2026082925A1Shielded interconnection structure, method for forming the same, and semiconductor packageJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 1457US12593397B2Electronic package and method for making the sameJCET STATS CHIPPAC KOREA LTD·Filed 2023·Granted Mar 31, 2026·0 cites·17 claims
- 1556US12588572B2Semiconductor device and method of forming fine pitch conductive posts with graphene-coated coresSTATS CHIPPAC PTE LTD·Filed 2023·Granted Mar 24, 2026·0 cites·21 claims
- 1655US2026053037A1Method and an apparatus for forming an electronic deviceSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 1754US2026005192A1Electronic device and a method for forming the sameSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 1853US12581974B2Semiconductor device and method of making a semiconductor package with graphene-coated interconnectsSTATS CHIPPAC PTE LTD·Filed 2023·Granted Mar 17, 2026·0 cites·24 claims
- 1949US12588017B2Method and apparatus of multi-link communication for vehicle in communication system based on frame information including multiple information schemesELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Granted Mar 24, 2026·0 cites·10 claims
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Identity basis: exact name match across USPTO filings. How scoring works →