Inventor · name-matched record
LEE HUNG-CHU
2 granted patents·0 citations·filing 2023–2024
23Inventor score
Files withHEWLETT PACKARD ENTPR DEV LP2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0165US12526948B2Cable modules with pogo pins for identification of cable module mounting location on cabled backplane panelHEWLETT PACKARD ENTPR DEV LP·Filed 2024·Granted Jan 13, 2026·0 cites·20 claims
- 0248US12561188B2Expansion board detectionHEWLETT PACKARD ENTPR DEV LP·Filed 2023·Granted Feb 24, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →