Inventor · name-matched record
LEE HYUNDONG
2 granted patents·1 pending application·0 citations·filing 2022–2025
23Inventor score
Files withKYUNGPOOK NAT UNIV IND ACADEMIC COOP FOUND1SAMSUNG ELECTRONICS CO LTD1SASMSUNG ELECTRONICS CO LTD1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
3 records- 0174US2026042175A1Solder alloy, solder paste, solder ball, solder joint, and electronic device including solder jointSASMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0254US12550759B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 0350US12530514B2Method of designing ternary logic circuit using MOSFETs having depletion-mode and multi-VTHS, and device and recording medium for performing the sameKYUNGPOOK NAT UNIV IND ACADEMIC COOP FOUND·Filed 2023·Granted Jan 20, 2026·0 cites·8 claims
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Identity basis: exact name match across USPTO filings. How scoring works →