Inventor · name-matched record

LEE JAE-JUN

1 granted patent·1 pending application·0 citations·filing 2023–2024

10Inventor score

Technology areasB01J H10W

Files withSK HYNIX INC1 WINTEC GLOVIS CO LTD1

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

Top patents by PatentIndex Score

2 records

0161US12568829B2Packaging device including bumps and method of manufacturing the sameSK HYNIX INC·Filed 2023·Granted Mar 3, 2026·0 cites·10 claims
0256US2026097390A1Regeneration apparatus for waste powder activated carbonWINTEC GLOVIS CO LTD·Filed 2024·Application pending·0 cites

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Identity basis: exact name match across USPTO filings. How scoring works →