Inventor · name-matched record
LEE JIHYUN
5 granted patents·9 pending applications·0 citations·filing 2023–2025
59Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
14 records- 0164US2026045414A1Multilayer ceramic capacitor and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2025·Application pending·0 cites
- 0263US12556805B2Electronic device and operation method of electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 17, 2026·0 cites·16 claims
- 0363US12541289B2Electronic device displaying image and method for operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Feb 3, 2026·0 cites·16 claims
- 0461US12546001B2Composition for depositing a silicon-containing layer and method of depositing a silicon-containing layer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·9 claims
- 0561US2026019983A1Bandwidth aggregation for positioning enhancementINTEL CORP·Filed 2023·Application pending·0 cites
- 0660US12593628B2Silicon precursor having a heterocyclic group, composition for depositing a silicon-containing layer comprising the same and method of depositing a silicon-containing layer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 31, 2026·0 cites·16 claims
- 0760US2026047491A1Semiconductor package and package on package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0855US2026095358A1Enhanced configuration of channel sounding signal for bandwidth stitching for wireless device positioningINTEL CORP·Filed 2023·Application pending·0 cites
- 0954US2026006574A1Signaling mechanisms for positioning for user equipments with reduced capabilityINTEL CORP·Filed 2023·Application pending·0 cites
- 1054US2026082404A1Methods and arrangements for resource allocation for sidelink positioningINTEL CORP·Filed 2023·Application pending·0 cites
- 1152US2026068778A1Package semiconductorSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1248US2026068715A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1343US2026060081A1Semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1430USD1120954SDisplay screen or portion thereof with transitional graphical user interfaceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Mar 31, 2026·0 cites·1 claims
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Identity basis: exact name match across USPTO filings. How scoring works →