Inventor · name-matched record
LEE MENG-TSAN
2 granted patents·3 pending applications·0 citations·filing 2016–2025
28Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0194US2026076210A1Semiconductor package with redistribution structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0269US12550737B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 0362US2026011648A1Packages with glass components and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0452US12550783B2Device and method for UBM/RDL routingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Feb 10, 2026·0 cites·20 claims
- 0550US2026090471A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when LEE MENG-TSAN files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →