Inventor · name-matched record
LEE MI SEON
1 granted patent·1 pending application·0 citations·filing 2023–2025
10Inventor score
Files withSK HYNIX INC2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0192US2026040920A1Semiconductor chip including through electrode, and semiconductor package including the sameSK HYNIX INC·Filed 2025·Application pending·0 cites
- 0261US12568829B2Packaging device including bumps and method of manufacturing the sameSK HYNIX INC·Filed 2023·Granted Mar 3, 2026·0 cites·10 claims
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Identity basis: exact name match across USPTO filings. How scoring works →