Inventor · name-matched record
LEE MING HAN
4 granted patents·2 pending applications·0 citations·filing 2022–2025
59Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD6
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
6 records- 0195US2026096414A1Protection liner on interconnect wire to enlarge processing window for overlying interconnect viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0290US2026076163A1Interconnect structure with hybrid barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0383US12550699B2Integrated circuit interconnect structure having discontinuous barrier layer and air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0483US12543550B2Interconnects including graphene capping and graphene barrier layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 3, 2026·0 cites·20 claims
- 0583US12525531B2Protection liner on interconnect wire to enlarge processing window for overlying interconnect viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 13, 2026·0 cites·20 claims
- 0674US12525538B2Semiconductor device structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 13, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →