Inventor · name-matched record
LEE SEOKHYUN
4 granted patents·0 citations·filing 2022–2024
53Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
4 records- 0175US12581978B2Semiconductor package including under bump metallization padSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Mar 17, 2026·0 cites·20 claims
- 0257US12519086B2Semiconductor package with redistribution substrateSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims
- 0353US12519079B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims
- 0452US12593737B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 31, 2026·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when LEE SEOKHYUN files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: exact name match across USPTO filings. How scoring works →