Inventor · name-matched record
LEE SEONHO
1 granted patent·4 pending applications·0 citations·filing 2022–2025
4Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0177US2026020232A1Semiconductor package having stacked interconnected semiconductor chipsSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0258US2026047401A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0357US2026053046A1Semiconductor package and method of manufactuing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0448US2026068779A1Semiconductor package including conductive postSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0547US12575371B2Method for manufacturing semiconductor package and protective film used thereforSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 10, 2026·0 cites·19 claims
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Identity basis: exact name match across USPTO filings. How scoring works →