Inventor · name-matched record
LEE SEUNGHYUN
11 granted patents·11 pending applications·0 citations·filing 2021–2025
77Inventor score
Files withJCET STATS CHIPPAC KOREA LTD8SAMSUNG ELECTRONICS CO LTD5SAMSUNG DISPLAY CO LTD3EUTILEX CO LTD1GOOGLE LLC1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
22 records- 0187US2026047291A1Display device and electronic device having the sameSAMSUNG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 0276US2026018573A1Semiconductor Device and Method of Forming Compartment Shielding for a Semiconductor PackageJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 0367US2026016431A1Device and method for evaluating convective heat transfer amount at top of cell during thermal runawaySAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0464US12587243B2Apparatus and method for transmitting and receiving signal according to channel state in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 24, 2026·0 cites·16 claims
- 0564US2026083029A1Semiconductor package and method for forming the sameJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 0664US2026076244A1Method and an apparatus for forming an electronic deviceJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 0763US12598873B2Display panel and electronic device including the sameSAMSUNG DISPLAY CO LTD·Filed 2022·Granted Apr 7, 2026·0 cites·20 claims
- 0863US12536677B2Method and apparatus for obtaining first and second images to detect first and second landmarks and face registration using 3D facial landmarkUNIV KWANGWOON IND ACAD COLLAB·Filed 2023·Granted Jan 27, 2026·0 cites·10 claims
- 0963US2026082974A1Semiconductor Device and Method of Making Using Epoxy-Solder PasteJCET STATS CHIPPAC KOREA LTD·Filed 2024·Application pending·0 cites
- 1062US12563921B2Display panel and display deviceLG DISPLAY CO LTD·Filed 2022·Granted Feb 24, 2026·0 cites·20 claims
- 1162US2026004546A1Vision-language model for image cropping through in-context learningGOOGLE LLC·Filed 2025·Application pending·0 cites
- 1260US2026005046A1Molding apparatus and method for making an electronic packageJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 1359US12581841B2Display apparatusSAMSUNG DISPLAY CO LTD·Filed 2022·Granted Mar 17, 2026·0 cites·20 claims
- 1459US2026082925A1Shielded interconnection structure, method for forming the same, and semiconductor packageJCET STATS CHIPPAC KOREA LTD·Filed 2025·Application pending·0 cites
- 1557US12593397B2Electronic package and method for making the sameJCET STATS CHIPPAC KOREA LTD·Filed 2023·Granted Mar 31, 2026·0 cites·17 claims
- 1657US12559538B2PD-1 polypeptide variantsEUTILEX CO LTD·Filed 2021·Granted Feb 24, 2026·0 cites·56 claims
- 1756US12588572B2Semiconductor device and method of forming fine pitch conductive posts with graphene-coated coresSTATS CHIPPAC PTE LTD·Filed 2023·Granted Mar 24, 2026·0 cites·21 claims
- 1853US12549235B2Method and apparatus for performing communication in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·17 claims
- 1951US12567884B2Apparatus and method for performing beam sweeping using RIS pattern in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 3, 2026·0 cites·18 claims
- 2051US12557714B2Method for making electronic packageJCET STATS CHIPPAC KOREA LTD·Filed 2023·Granted Feb 17, 2026·0 cites·9 claims
- 2151US2026089979A1Semiconductor device and electronic system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 2249US2026005742A1Method and apparatus for reporting channel state information in wireless communication systemSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →