Inventor · name-matched record
LEE WONIL
1 granted patent·4 pending applications·0 citations·filing 2023–2025
1Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0181US2026011666A1Method of manufacturing semiconductor package including thermal compression processSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0278US2026101766A1Method of manufacturing semiconductor package including semiconductor chip having internal and external marksSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0368US2026007001A1Display panel and electronic device including the sameSAMSUNG DISPLAY CO LTD·Filed 2025·Application pending·0 cites
- 0460US2026068687A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0555US12588567B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 24, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →