Inventor · name-matched record

LI CHIEN-CHEN

1 granted patent·1 pending application·0 citations·filing 2022–2025

13Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD2

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

Top patents by PatentIndex Score

2 records

0183US2026090399A1Dummy through vias for integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0270US12557646B2Multi-die package and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 17, 2026·0 cites·20 claims

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Identity basis: exact name match across USPTO filings. How scoring works →