Inventor · name-matched record
LI DENGFENG
5 granted patents·0 citations·filing 2021–2023
58Inventor score
Files withTENCENT TECH SHENZHEN CO LTD2HUAWEI TECH CO LTD1TENCENT TECH SHENZHEN COMPANY LIMITED1UNIV CITY HONG KONG1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0164US12568805B2Silicon wafer and method for filling silicon via thereofTENCENT TECH SHENZHEN CO LTD·Filed 2023·Granted Mar 3, 2026·0 cites·19 claims
- 0263US12550626B2Method for preparing josephson junction and production line deviceTENCENT TECH SHENZHEN CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 0359US12559214B2Fish-like shape robotic deviceUNIV CITY HONG KONG·Filed 2023·Granted Feb 24, 2026·0 cites·20 claims
- 0456US12598967B2Through silicon via interconnection structure and method of forming same, and quantum computing deviceTENCENT TECH SHENZHEN COMPANY LIMITED·Filed 2023·Granted Apr 7, 2026·0 cites·19 claims
- 0535US12532075B2Pan-tilt-zoom module, camera module, and electronic deviceHUAWEI TECH CO LTD·Filed 2021·Granted Jan 20, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →