Inventor · name-matched record
LI WENHAO
8 granted patents·7 pending applications·0 citations·filing 2022–2025
71Inventor score
Files withINTEL CORP9SUNGROW POWER SUPPLY CO LTD2BEIJING ZITIAO NETWORK TECHNOLOGY CO LTD1TENCENT TECH SHENZHEN CO LTD1UNIV MASSACHUSETTS1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
15 records- 0178US12522544B2Nanoporous structures and assemblies incorporating the sameUNIV MASSACHUSETTS·Filed 2024·Granted Jan 13, 2026·0 cites·20 claims
- 0267US2026004491A1Image processing method and apparatus, device, and mediumBEIJING ZITIAO NETWORK TECHNOLOGY CO LTD·Filed 2025·Application pending·0 cites
- 0361US12532740B2Porous mesh structures for the thermal management of integrated circuit devicesINTEL CORP·Filed 2022·Granted Jan 20, 2026·0 cites·20 claims
- 0461US2026090452A1Integrated circuit packages including a high thermal conductivity material coupled to a substrate with microchannels in 3 dimensional die stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 0561US2026090450A1Integrated circuit packages including a high thermal conductivity material in 3 dimensional die stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 0660US2026090454A1Integrated circuit packages including 3 dimensional die stacks with a die having a sidewall modificationINTEL CORP·Filed 2024·Application pending·0 cites
- 0760US2026090453A1Integrated circuit packages including a structural die coupled to a high thermal conductivity material in 3 dimensional die stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 0860US2026090451A1Integrated circuit packages including a heat spreader having a high thermal conductivity material in 3 dimensional die stacksINTEL CORP·Filed 2024·Application pending·0 cites
- 0958US12598989B2Package structures with patterned die backside layerINTEL CORP·Filed 2022·Granted Apr 7, 2026·0 cites·13 claims
- 1057US12573827B2Threading sealing boxSUNGROW POWER SUPPLY CO LTD·Filed 2022·Granted Mar 10, 2026·0 cites·18 claims
- 1156US12550276B2Connector and power apparatus case shellSUNGROW POWER SUPPLY CO LTD·Filed 2022·Granted Feb 10, 2026·0 cites·14 claims
- 1256US12532739B2Metal matrix composite layers having graded filler content for heat dissipation from integrated circuit devicesINTEL CORP·Filed 2022·Granted Jan 20, 2026·0 cites·20 claims
- 1355US12550781B2Template structure for quasi-monolithic die architecturesINTEL CORP·Filed 2022·Granted Feb 10, 2026·0 cites·20 claims
- 1455US12536053B2Resource transfer information detection method and apparatus, device, and storage mediumTENCENT TECH SHENZHEN CO LTD·Filed 2023·Granted Jan 27, 2026·0 cites·19 claims
- 1550US2026084593A1Fixing component, mounting component, and baby productWONDERLAND SWITZERLAND AG·Filed 2023·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →