Inventor · name-matched record
Liang yu-min
1 granted patent·1 pending application·0 citations·filing 2022–2024
13Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0172US12588525B2Packaging substrate including an underfill injection opening and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 24, 2026·0 cites·20 claims
- 0264US2026096477A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →