Inventor · name-matched record
LII MIRNG-JI
8 granted patents·5 pending applications·0 citations·filing 2021–2025
73Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
13 records- 0197US2026060151A1Packages with stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0294US2026068689A1Heterogeneous bonding structure and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0386US2026060095A1Mimcap corner structures in the keep-out zones of a semiconductor die and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0483US12532789B2Package structure with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 20, 2026·0 cites·20 claims
- 0581US12538836B2Seal ring structure in the peripheral of device dies and with zigzag patterns and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 27, 2026·0 cites·20 claims
- 0675US12550710B2Semiconductor dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 10, 2026·0 cites·20 claims
- 0773US2026101742A1Stacking via configuration for advanced silicon node products and methods for forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LIMITED·Filed 2025·Application pending·0 cites
- 0870US12598995B2Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 7, 2026·0 cites·20 claims
- 0963US12519055B2Stacking via configuration for advanced silicon node products and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 6, 2026·0 cites·20 claims
- 1063US2026053013A1Package structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1162US12532738B2Chip package structure with heat conductive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 20, 2026·0 cites·19 claims
- 1257US12525556B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 13, 2026·0 cites·20 claims
- 1354US12581935B2Stacked via structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 17, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →