Inventor · name-matched record
LIM SEOK LING
2 granted patents·3 pending applications·0 citations·filing 2022–2024
23Inventor score
Files withINTEL CORP5
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0163US2026068174A1Overhang architectures for high bandwidth memory (hbm) multi-die assemblies and methods for making sameINTEL CORP·Filed 2024·Application pending·0 cites
- 0262US12599013B2Semiconductor packages for stacked memory-on-package (SMOP) and methods of manufacturing the sameINTEL CORP·Filed 2022·Granted Apr 7, 2026·0 cites·15 claims
- 0356US12588511B2Shielding assembly for semiconductor packagesINTEL CORP·Filed 2022·Granted Mar 24, 2026·0 cites·12 claims
- 0455US2026096027A1Flexible mounting structures for surface mount componentsINTEL CORP·Filed 2024·Application pending·0 cites
- 0553US2026090466A1Technologies for a stacked integrated circuit packageINTEL CORP·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →