Inventor · name-matched record

LIN CHENG-NAN

2 granted patents·1 pending application·0 citations·filing 2022–2024

24Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD3

This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.

Top patents by PatentIndex Score

3 records

0162US12532738B2Chip package structure with heat conductive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 20, 2026·0 cites·19 claims
0258US2026096465A1Passivation layer stack for stress reduction on a semiconductor die and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
0354US12581935B2Stacked via structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 17, 2026·0 cites·20 claims

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Identity basis: exact name match across USPTO filings. How scoring works →