Inventor · name-matched record
LIN CHENGCHUNG
3 granted patents·2 pending applications·0 citations·filing 2023–2023
38Inventor score
Files withSJ SEMICONDUCTOR JIANGYIN CORP5
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0164US12550740B2Chip packaging structure and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Granted Feb 10, 2026·0 cites·5 claims
- 0258US12588544B2Packaging structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Granted Mar 24, 2026·0 cites·8 claims
- 0357US12525581B2Pop structure of three-dimensional fan-out memory and packaging method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Granted Jan 13, 2026·0 cites·4 claims
- 0457US2026082981A1Chip packaging structure and preparation methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 0557US2026090379A1Chip packaging structure and preparation methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →