Inventor · name-matched record
LIN CHI-YEN
2 granted patents·8 pending applications·0 citations·filing 2022–2024
25Inventor score
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
10 records- 0167US12543317B2Memory device with improved data retentionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 3, 2026·0 cites·20 claims
- 0267US2026036526A1Surface inspection tool for transfer tools and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0362US2026053001A1Bonded die structures with improved die positioning and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0461US2026052939A1High-efficiency inner air purge design for frame cassettes for semiconductor manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0561US2026052991A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0661US2026052992A1Hybrid bonding using stress-relief dummy pads and methods of forming and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0761US2026060022A1Bonded die structures with reduced crack defects and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0860US2026096455A1Multi-tiered device having an aligned through-via and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0960US2026014713A1Nozzle with support structures for use in a pick-and-place machine and methods of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1055US12570852B2Polyimide precursor, resin composition including, and polyimide formed from such precursor, and use of the polyimideDAXIN MAT CORP·Filed 2022·Granted Mar 10, 2026·0 cites·11 claims
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Identity basis: exact name match across USPTO filings. How scoring works →