Inventor · name-matched record
LIN CHIH-WEI
1 granted patent·1 pending application·0 citations·filing 2022–2025
14Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD2
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
2 records- 0183US2026090476A1Semiconductor package and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0269US12568854B2Semiconductor packages having semiconductor blocks surrounding semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 3, 2026·0 cites·20 claims
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Identity basis: exact name match across USPTO filings. How scoring works →