Inventor · name-matched record
LIN KENG-CHU
7 granted patents·8 pending applications·0 citations·filing 2022–2025
69Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11TAIWAN SEMICONDUCTOR MFG COMPANY LTD3TAIWAN SEMICONDUCTOR MFG COMPANY LID1
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
15 records- 0182US2026101681A1Wafer bonding method and semiconductor structure obtained by the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0281US2026101684A1Wafer bonding method and semiconductor structure manufactured using the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2025·Application pending·0 cites
- 0379US2026006816A1Contact Structure For Semiconductor DeviceTAIWAN SEMICONDUCTOR MFG COMPANY LID·Filed 2025·Application pending·0 cites
- 0478US12532716B2Low thermal budget dielectric for semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 20, 2026·0 cites·20 claims
- 0575US12598766B2Contact interface engineering for reducing contact resistanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 7, 2026·0 cites·20 claims
- 0672US12588268B2Liner-free conductive structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 24, 2026·0 cites·20 claims
- 0767US2026040626A1Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0866US12575141B2Metal-comprising bottom isolation structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 10, 2026·0 cites·20 claims
- 0963US12599042B2Carrier structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG COMPANY LTD·Filed 2023·Granted Apr 7, 2026·0 cites·20 claims
- 1063US12550720B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 10, 2026·0 cites·20 claims
- 1162US2026096163A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1261US12575405B2Semiconductor device with air gap and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 10, 2026·0 cites·20 claims
- 1360US2026096144A1Backside transistors in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1459US2026075924A1Wafer bonding method and semiconductor structure obtained by the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1557US2026040984A1Wafer bonding with enhanced thermal dissipationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →