Inventor · name-matched record
LIN MENG-LIANG
3 granted patents·2 pending applications·0 citations·filing 2022–2025
46Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5
This identity is grouped by exact name match (no disambiguated inventor record was available for these filings) — it may combine same-named inventors.
Top patents by PatentIndex Score
5 records- 0182US12564076B2Chip package with fan-out feature and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Feb 24, 2026·0 cites·20 claims
- 0272US12538819B2Inductor RF isolation structure in an interposer and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 27, 2026·0 cites·20 claims
- 0368US2026082922A1Semiconductor device including stress control layer and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0467US12532771B2Package structure with fan-out featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 20, 2026·0 cites·20 claims
- 0559US2026033353A1Redistribution structures with seal rings and the methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: exact name match across USPTO filings. How scoring works →